Following the recent Cabinet approves semiconductor manufacturing units in ODISHA, PUNJAB and ANDHRA PRADESH with an outlay of Rs.4600 crore
The Union Cabinet chaired by Prime Minister Narendra Modi approved four more Semiconductor Units under India Semiconductor Mission (ISM).
Momentum is building up in semiconductor ecosystem in India with the six approved projects already in various stages of execution. These four proposals approved today are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies.
Centre Clears 4,600 Crore for Four New Semiconductor Units
The government has approved four proposals to set up semiconductor manufacturing facilities with a total investment of about ₹4,600 crore, expected to employ 2,034 skilled professionals and boost the electronics manufacturing ecosystem, creating many indirect jobs.. With these four more approvals today, total approved projects under ISM reaches to 10 with cumulative investments of around Rs.1.60 lakh crore in 6 states.
Given the growing demand of semiconductors in telecom, automotive, datacentres, consumer electronics and industrial electronics, these four new approved semiconductors projects would significantly contribute to making Atmanirbhar Bharat.
SiCSem and 3D Glass will be set up in Odisha. CDIL is located in Punjab and ASIP will be set up in Andhra Pradesh.
Odisha to Host India’s First SiC Compound Fab and Advanced Semiconductor Packaging Unit
SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd., UK, to establish integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneshwar, Odisha. This will be 1st commercial compound fab in the country. The project proposes to manufacture Silicon Carbide devices. This compound semiconductor fab will have an annual capacity of 60,000 wafers and packaging capacity of 96 million units. The proposed products will have applications in Missiles and Defence equipment. They will also be used in Electric Vehicles (EVs) and Railway. Additional applications include Fast Chargers, Data Centre racks, Consumer Appliances, and Solar Power Inverters.
3D Glass Solutions Inc. (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This unit will bring world’s most advanced packaging technology to India. Advanced packaging brings the next generation of efficiency to semiconductor industry. The facility will have a large variety of advanced technologies. These technologies include glass interposers with passives and silicon bridges. They also include 3D Heterogeneous Integration (3DHI) modules. Planned capacity of this unit will include approximately 69,600 glass panel substrates annually. It will also include 50 million assembled units and 13,200 3DHI modules per annum. The proposed products will have significant applications in defence, high-performance computing, and artificial intelligence. Industries will also use them in RF and automotive sectors, as well as in photonics and co-packaged optics.
ASIP to Build Semiconductor Unit in Andhra, CDIL to Expand Mohali Facility
Advanced System in Package Technologies (ASIP) will set up a semiconductor manufacturing unit in Andhra Pradesh. They will do this under a technology tie-up with APACT Co. Ltd, South Korea, with an annual capacity of 96 Million units. The manufactured products will find applications in mobile phones, set-top boxes, automobile applications, and other electronic products.
Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab. The proposed facility will produce high-power discrete semiconductor devices. These will include MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors. Manufacturers will use both silicon and silicon carbide to produce them. The annual capacity of this brownfield expansion will be to the tune of 158.38 million units. The devices manufactured by these proposed units will have applications in Automotive electronics, including EVs and its charging infrastructure. Industries will also use them in renewable energy systems, power conversion applications, industrial operations, and communication infrastructure.
India’s Semiconductor Ecosystem Gets Major Boost with New Projects, Talent Development
With the approval of these projects, the semiconductor ecosystem in the country would get a significant boost. These projects include the country’s first commercial compound fab. They also include a highly advanced glass-based substrate semiconductor packaging unit.
These would complement the growing world class chip design capabilities emerging in the country. They are propelled by design infrastructure support. This support is provided by the Government to 278 academic institutions and 72 start-ups.
Already more than 60,000 students have availed the benefits of talent development programme.
